15 Apr Madison selected for third Americas Competitiveness Exchange tour
Madison has been selected as a featured site in the Third Americas Competitiveness Exchange (ACE), a tour designed to showcase advanced technology centers, innovation hubs, public-private partnerships, exports, and foreign direct investments in Wisconsin, Minnesota, and Illinois.
ACE is a collaboration among the U.S. Department of Commerce, through the International Trade Administration (ITA) and the Economic Development Administration (EDA), the U.S. Department of State, the Government of Guatemala, as Chair Pro Tempore of RIAC 2015, and the Organization of American States (OAS).
Madison Region Economic Partnership will host the international delegation on April 21 & 22, having submitted a winning proposal to the ACE consortium. The delegation consists of nearly 50 foreign trade and innovation ministers, private sector leaders, mayors from major cities, chancellors/presidents of universities, presidents of competitiveness councils and other senior leadership from 28 countries, including many in Latin America as well as Canada and Georgia.
Several high-ranking officials from the U.S. government will also be in Madison during the tour, including The Honorable U.S. Assistant Secretary of Commerce for Economic Development Jay Williams.
“This is an extraordinary opportunity to feature Madison and its many academic, innovation and industry assets to a prominent foreign delegation,” notes Paul Jadin, president of Madison Region Economic Partnership. “Being selected for the ACE tour points to the region’s global recognition as a leader in technology and innovation that invites international exchange.”
The EDA has issued a detailed press release about the ACE tour, available at this link: http://www.eda.gov/news/press-releases/2015/04/14/ace.htm
Members of the press are invited to all portions of the ACE tour, however key places and times for optimal photo, video, and interview opportunities are listed below and attached on page 2. The full tour agenda is listed below and attached on page 3.